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Next-Generation Memory Market By Technology (Non-Volatile Memory (Magneto-Resistive Randon-Access Memory (MRAM), Ferroelectric RAM (FRAM)), Volatile Memory (Hybrid Memory Cube (HMC), High-Bandwidth Memory (HBM)), By Wafer Size (200 mm, 300 mm), By Application (Consumer Electronics, Enterprise Storage, Automotive & Transportation, Military & Aerospace, Industrial, Telecommunications, Energy & Power, Healthcare, Agricultural, Retail), and by Region; Global Insights & Forecast (2024 – 2030)

Published: N/A

| Report ID: SE3459

| Semiconductor and Electronics