As per Intent Market Research, the Passive and Interconnecting Electronic Components Market was valued at USD 27.8 Billion in 2024-e and will surpass USD 80.3 Billion by 2030; growing at a CAGR of 16.4% during 2025-2030.
The passive and interconnecting electronic components market plays a critical role in modern electronics by providing essential components that enable functionality, performance, and connectivity across various industries. The market is witnessing steady growth due to increasing demand from key sectors such as consumer electronics, automotive, and industrial electronics. Passive components like capacitors, resistors, and inductors are indispensable in managing electrical energy, whereas interconnecting components such as connectors and switches ensure the seamless transmission of signals and power. With ongoing advancements in technology and rising demand for miniaturization and energy-efficient products, this market continues to evolve and expand.
Capacitors Segment is Largest Owing to Broad Demand Across Industries
Among the passive components, capacitors dominate the market, accounting for the largest share in terms of demand and production. Capacitors are essential in smoothing electrical signals, storing energy, and filtering power across a variety of applications. They are used in nearly every electronic device, including smartphones, computers, and televisions, due to their reliability and versatility. In the automotive sector, capacitors are integral to advanced electronic systems, including electric vehicle batteries, powertrain systems, and autonomous driving technologies. The increasing demand for consumer electronics, particularly in emerging markets, has fueled the growth of the capacitor segment, making it the largest subsegment within the passive components market.
The capacitors segment is further boosted by technological advancements such as the development of solid-state capacitors that offer higher performance and energy efficiency. These innovations are particularly in demand for applications in renewable energy systems, industrial automation, and electric vehicles, where long-lasting, efficient energy storage and signal control are crucial.
Connectors Segment is Fastest Growing Due to Growing Demand for Connectivity
The interconnecting components segment is expanding rapidly, with connectors emerging as the fastest-growing subsegment. Connectors are used to join electrical circuits and components, ensuring the efficient transfer of power and data. The surge in demand for connectors is largely driven by the increasing adoption of electronic devices in industries such as automotive, industrial automation, and communication. The automotive sector, in particular, is undergoing a transformation with the integration of electric vehicles (EVs) and autonomous driving systems, both of which require sophisticated connector systems for high-speed data transmission and energy management.
As the Internet of Things (IoT) continues to evolve, the need for connectors in smart devices and communication networks is set to expand. The widespread implementation of 5G networks further drives this growth, as connectors are crucial for establishing reliable and high-speed communication between devices. The rising need for wireless communication and miniaturization in consumer electronics also contributes to the rapid growth of the connector market.
Consumer Electronics is the Largest Application Segment
Consumer electronics is the largest application segment within the passive and interconnecting electronic components market, accounting for a significant portion of global demand. Devices such as smartphones, laptops, televisions, and wearables are built with numerous passive components like capacitors, resistors, and inductors, as well as interconnecting components such as connectors and switches. The continuous innovation in this sector, with the introduction of new, high-performance devices, drives demand for these components.
In particular, the trend towards thinner, more compact devices and increased functionality requires more advanced components that can handle higher performance while taking up less space. As consumer electronics manufacturers aim to enhance the performance and energy efficiency of their products, the need for reliable passive and interconnecting components will continue to rise.
Automotive Sector is a Key End-User Industry for Passive and Interconnecting Components
In the end-user industry segment, the automotive sector is a significant driver of growth in the passive and interconnecting electronic components market. Modern vehicles, especially electric and hybrid vehicles, rely heavily on electronic systems for power management, connectivity, and safety features. Components such as capacitors, resistors, connectors, and switches are used in various automotive applications, from battery management systems to electric drive systems, infotainment, and autonomous driving technologies.
With the automotive industry's shift toward electrification and increasing focus on autonomous driving, the demand for sophisticated electronic components continues to rise. Additionally, the automotive sector is a major consumer of interconnecting components, particularly connectors, which are crucial for maintaining the reliability and safety of electrical systems in vehicles. As electric and self-driving cars become more widespread, the automotive industry will remain one of the largest consumers of passive and interconnecting components.
Asia Pacific Region is the Largest Market for Passive and Interconnecting Electronic Components
The Asia Pacific region is the largest market for passive and interconnecting electronic components, driven by the high concentration of electronics manufacturing in countries like China, Japan, South Korea, and Taiwan. The region is home to some of the world’s largest electronics companies, and its manufacturing capabilities make it a hub for component production. The rapid growth of the consumer electronics and automotive industries in countries such as China and India further boosts the demand for these components.
Additionally, the Asia Pacific region is witnessing a rise in technological advancements and innovation in the automotive sector, particularly with the increase in electric vehicle production. The adoption of smart technologies and the rollout of 5G networks across countries in Asia Pacific also contribute to the growth of the passive and interconnecting electronic components market in this region. As manufacturing continues to expand in Asia, the region’s dominance in the global market is expected to persist.
Competitive Landscape and Leading Companies
The passive and interconnecting electronic components market is highly competitive, with several key players dominating the market share. Leading companies such as Murata Manufacturing Co., Ltd., TDK Corporation, Vishay Intertechnology, TE Connectivity Ltd., and Amphenol Corporation continue to drive innovation and product development in the sector. These companies focus on providing high-performance, energy-efficient solutions across industries such as automotive, consumer electronics, and industrial manufacturing.
With the growing demand for miniaturized, high-performance components, market players are focusing on research and development to offer new, advanced solutions. Strategic partnerships, acquisitions, and collaborations are common strategies used by these companies to strengthen their product portfolios and expand their global reach. The market also sees increased mergers and acquisitions as companies aim to gain technological expertise and increase their market share, particularly in the automotive and IoT sectors.
List of Leading Companies:
- Murata Manufacturing Co. Ltd.
- Samsung Electro-Mechanics Co. Ltd.
- TDK Corporation
- Vishay Intertechnology Inc.
- Panasonic Corporation
- Nippon Chemi-Con Corporation
- Yageo Corporation
- TE Connectivity Ltd.
- Amphenol Corporation
- Connectors, Inc.
- Littelfuse Inc.
- Schurter AG
- STMicroelectronics
- ON Semiconductor
- ROHM Semiconductor
Recent Developments:
- Murata Manufacturing Co. Ltd. has introduced a new line of high-performance capacitors, aimed at meeting the increasing demand for efficient and compact energy storage solutions in consumer electronics.
- TDK Corporation announced a partnership with a major electric vehicle manufacturer to supply advanced passive components, helping to improve the performance and reliability of electric drivetrains.
- Panasonic Corporation launched a new range of inductors designed specifically for automotive applications, enhancing power efficiency and reducing electromagnetic interference in electric vehicles.
- Vishay Intertechnology Inc. completed the acquisition of a leading resistor manufacturer, strengthening its position in the passive component sector and expanding its product portfolio for automotive and industrial markets.
- Yageo Corporation received a regulatory certification for its new series of resistors, which offer improved energy efficiency and are poised to be incorporated into 5G network infrastructure.
Report Scope:
Report Features |
Description |
Market Size (2024-e) |
USD 27.8 Billion |
Forecasted Value (2030) |
USD 80.3 Billion |
CAGR (2025 – 2030) |
16.4% |
Base Year for Estimation |
2024-e |
Historic Year |
2023 |
Forecast Period |
2025 – 2030 |
Report Coverage |
Market Forecast, Market Dynamics, Competitive Landscape, Recent Developments |
Segments Covered |
Passive and Interconnecting Electronic Components Market By Type (Capacitors, Resistors, Inductors, Transformers, Piezoelectric Components), By Type of Interconnecting Components (Connectors, Switches, Relays, Sockets, Terminals), By Application (Consumer Electronics, Automotive, Industrial Electronics, Communication, Power Generation & Distribution), By End-User Industry (Automotive, Consumer Electronics, Industrial Manufacturing, Communication & IT, Energy & Utilities) |
Regional Analysis |
North America (US, Canada, Mexico), Europe (Germany, France, UK, Italy, Spain, and Rest of Europe), Asia-Pacific (China, Japan, South Korea, Australia, India, and Rest of Asia-Pacific), Latin America (Brazil, Argentina, and Rest of Latin America), Middle East & Africa (Saudi Arabia, UAE, Rest of Middle East & Africa) |
Major Companies |
Murata Manufacturing Co. Ltd., Samsung Electro-Mechanics Co. Ltd., TDK Corporation, Vishay Intertechnology Inc., Panasonic Corporation, Nippon Chemi-Con Corporation, Yageo Corporation, TE Connectivity Ltd., Amphenol Corporation, Connectors, Inc., Littelfuse Inc., Schurter AG, STMicroelectronics, ON Semiconductor, ROHM Semiconductor |
Customization Scope |
Customization for segments, region/country-level will be provided. Moreover, additional customization can be done based on the requirements |
1. Introduction |
1.1. Market Definition |
1.2. Scope of the Study |
1.3. Research Assumptions |
1.4. Study Limitations |
2. Research Methodology |
2.1. Research Approach |
2.1.1. Top-Down Method |
2.1.2. Bottom-Up Method |
2.1.3. Factor Impact Analysis |
2.2. Insights & Data Collection Process |
2.2.1. Secondary Research |
2.2.2. Primary Research |
2.3. Data Mining Process |
2.3.1. Data Analysis |
2.3.2. Data Validation and Revalidation |
2.3.3. Data Triangulation |
3. Executive Summary |
3.1. Major Markets & Segments |
3.2. Highest Growing Regions and Respective Countries |
3.3. Impact of Growth Drivers & Inhibitors |
3.4. Regulatory Overview by Country |
4. Passive and Interconnecting Electronic Components Market, by Type of Passive Components (Market Size & Forecast: USD Million, 2023 – 2030) |
4.1. Capacitors |
4.2. Resistors |
4.3. Inductors |
4.4. Transformers |
4.5. Piezoelectric Components |
5. Passive and Interconnecting Electronic Components Market, by Type of Interconnecting Components (Market Size & Forecast: USD Million, 2023 – 2030) |
5.1. Connectors |
5.2. Switches |
5.3. Relays |
5.4. Sockets |
5.5. Terminals |
6. Passive and Interconnecting Electronic Components Market, by Application (Market Size & Forecast: USD Million, 2023 – 2030) |
6.1. Consumer Electronics |
6.2. Automotive |
6.3. Industrial Electronics |
6.4. Communication |
6.5. Power Generation & Distribution |
7. Passive and Interconnecting Electronic Components Market, by End-User Industry (Market Size & Forecast: USD Million, 2023 – 2030) |
7.1. Automotive |
7.2. Consumer Electronics |
7.3. Industrial Manufacturing |
7.4. Communication & IT |
7.5. Energy & Utilities |
8. Regional Analysis (Market Size & Forecast: USD Million, 2023 – 2030) |
8.1. Regional Overview |
8.2. North America |
8.2.1. Regional Trends & Growth Drivers |
8.2.2. Barriers & Challenges |
8.2.3. Opportunities |
8.2.4. Factor Impact Analysis |
8.2.5. Technology Trends |
8.2.6. North America Passive and Interconnecting Electronic Components Market, by Type of Passive Components |
8.2.7. North America Passive and Interconnecting Electronic Components Market, by Type of Interconnecting Components |
8.2.8. North America Passive and Interconnecting Electronic Components Market, by Application |
8.2.9. North America Passive and Interconnecting Electronic Components Market, by End-User Industry |
8.2.10. By Country |
8.2.10.1. US |
8.2.10.1.1. US Passive and Interconnecting Electronic Components Market, by Type of Passive Components |
8.2.10.1.2. US Passive and Interconnecting Electronic Components Market, by Type of Interconnecting Components |
8.2.10.1.3. US Passive and Interconnecting Electronic Components Market, by Application |
8.2.10.1.4. US Passive and Interconnecting Electronic Components Market, by End-User Industry |
8.2.10.2. Canada |
8.2.10.3. Mexico |
*Similar segmentation will be provided for each region and country |
8.3. Europe |
8.4. Asia-Pacific |
8.5. Latin America |
8.6. Middle East & Africa |
9. Competitive Landscape |
9.1. Overview of the Key Players |
9.2. Competitive Ecosystem |
9.2.1. Level of Fragmentation |
9.2.2. Market Consolidation |
9.2.3. Product Innovation |
9.3. Company Share Analysis |
9.4. Company Benchmarking Matrix |
9.4.1. Strategic Overview |
9.4.2. Product Innovations |
9.5. Start-up Ecosystem |
9.6. Strategic Competitive Insights/ Customer Imperatives |
9.7. ESG Matrix/ Sustainability Matrix |
9.8. Manufacturing Network |
9.8.1. Locations |
9.8.2. Supply Chain and Logistics |
9.8.3. Product Flexibility/Customization |
9.8.4. Digital Transformation and Connectivity |
9.8.5. Environmental and Regulatory Compliance |
9.9. Technology Readiness Level Matrix |
9.10. Technology Maturity Curve |
9.11. Buying Criteria |
10. Company Profiles |
10.1. Murata Manufacturing Co. Ltd. |
10.1.1. Company Overview |
10.1.2. Company Financials |
10.1.3. Product/Service Portfolio |
10.1.4. Recent Developments |
10.1.5. IMR Analysis |
*Similar information will be provided for other companies |
10.2. Samsung Electro-Mechanics Co. Ltd. |
10.3. TDK Corporation |
10.4. Vishay Intertechnology Inc. |
10.5. Panasonic Corporation |
10.6. Nippon Chemi-Con Corporation |
10.7. Yageo Corporation |
10.8. TE Connectivity Ltd. |
10.9. Amphenol Corporation |
10.10. Connectors, Inc. |
10.11. Littelfuse Inc. |
10.12. Schurter AG |
10.13. STMicroelectronics |
10.14. ON Semiconductor |
10.15. ROHM Semiconductor |
11. Appendix |
A comprehensive market research approach was employed to gather and analyze data on the Passive and Interconnecting Electronic Components Market. In the process, the analysis was also done to analyze the parent market and relevant adjacencies to measure the impact of them on the Passive and Interconnecting Electronic Components Market. The research methodology encompassed both secondary and primary research techniques, ensuring the accuracy and credibility of the findings.
Secondary Research
Secondary research involved a thorough review of pertinent industry reports, journals, articles, and publications. Additionally, annual reports, press releases, and investor presentations of industry players were scrutinized to gain insights into their market positioning and strategies.
Primary Research
Primary research involved conducting in-depth interviews with industry experts, stakeholders, and market participants across the E-Waste Management ecosystem. The primary research objectives included:
- Validating findings and assumptions derived from secondary research
- Gathering qualitative and quantitative data on market trends, drivers, and challenges
- Understanding the demand-side dynamics, encompassing end-users, component manufacturers, facility providers, and service providers
- Assessing the supply-side landscape, including technological advancements and recent developments
Market Size Assessment
A combination of top-down and bottom-up approaches was utilized to analyze the overall size of the Passive and Interconnecting Electronic Components Market. These methods were also employed to assess the size of various subsegments within the market. The market size assessment methodology encompassed the following steps:
- Identification of key industry players and relevant revenues through extensive secondary research
- Determination of the industry's supply chain and market size, in terms of value, through primary and secondary research processes
- Calculation of percentage shares, splits, and breakdowns using secondary sources and verification through primary sources
Data Triangulation
To ensure the accuracy and reliability of the market size, data triangulation was implemented. This involved cross-referencing data from various sources, including demand and supply side factors, market trends, and expert opinions. Additionally, top-down and bottom-up approaches were employed to validate the market size assessment.
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