Flexible Printed Circuit Boards Market By Product Type (Single-Sided Flexible Printed Circuits, Double-Sided Flexible Printed Circuits, Multilayer Flexible Printed Circuits, Rigid-Flex Circuits), By End-User Industry (Consumer Electronics, Automotive, Healthcare, Aerospace & Defense, Industrial & Manufacturing, Telecommunications, Energy & Power), By Application (Wearable Devices, Medical Devices, Smartphones, Automotive Electronics, Industrial Automation, LED Lighting, Sensors), By Technology (Printed Electronics, Hybrid Circuits, Thin-Film Flexible Circuits, Stretchable Circuits); Global Insights & Forecast (2024 – 2030)

As per Intent Market Research, the Flexible Printed Circuit Boards Market was valued at USD 25.9 billion in 2023 and will surpass USD 42.5 billion by 2030; growing at a CAGR of 7.3% during 2024 - 2030.

The flexible printed circuit boards (FPCBs) market has experienced substantial growth due to the increasing demand for compact, lightweight, and highly durable electronic components across a wide range of industries. Flexible PCBs are used to make flexible, reliable, and miniaturized electronic systems, offering benefits such as flexibility, enhanced design flexibility, and reduced weight. They have become an essential part of consumer electronics, automotive, healthcare devices, and industrial applications, providing greater design possibilities and functionality. This market is expected to continue expanding with technological advancements in manufacturing processes, including the development of thin-film and stretchable circuits.

Single-Sided Flexible Printed Circuits is Largest Owing to Widespread Use in Consumer Electronics

Single-sided flexible printed circuits are the most widely used type of flexible circuit, owing to their simplicity, cost-effectiveness, and applicability in many industries, particularly consumer electronics. These circuits, which feature a conductive pattern on one side of a flexible substrate, are ideal for devices where space and weight are limited, such as smartphones, tablets, and wearable electronics. The ease of design and relatively low manufacturing cost of single-sided circuits make them the most commercially viable option for mass-market applications, especially in the consumer electronics segment. This segment is expected to maintain dominance due to the continued demand for portable electronics and wearable devices that require lightweight, space-saving solutions.

Automotive Industry is Fastest Growing Owing to Increasing Demand for Advanced Automotive Electronics

The automotive industry is one of the fastest-growing end-user sectors for flexible printed circuit boards, driven by the growing adoption of advanced electronics in vehicles. Flexible PCBs are used extensively in automotive applications, including infotainment systems, lighting, advanced driver-assistance systems (ADAS), and electric vehicle (EV) components. The need for more compact, flexible, and durable electronic systems in vehicles, especially in the context of electric and autonomous vehicles, is fueling the demand for FPCBs in the automotive sector. As vehicle manufacturers incorporate more electronic features for safety, convenience, and connectivity, the use of flexible printed circuits in automotive electronics is set to grow at a rapid pace.

Wearable Devices Application is Largest Owing to Advancements in Personal Technology

Wearable devices are the largest application segment for flexible printed circuit boards, driven by the rise of fitness trackers, smartwatches, and health-monitoring devices. FPCBs are ideal for wearables because they enable the creation of compact, lightweight, and flexible designs, which are critical for devices worn on the body. The demand for more advanced, feature-rich wearable devices with improved battery life, seamless connectivity, and enhanced functionality continues to propel the market. Moreover, advancements in health-related applications, such as smart healthcare monitors and biosensors, are further increasing the adoption of FPCBs in the wearable segment, contributing to its market dominance.

Printed Electronics Technology is Largest Owing to Its Widespread Adoption in Consumer Electronics

Printed electronics technology is the largest technology segment in the flexible printed circuit boards market, owing to its established presence and growing use in various industries. Printed electronics involve the use of inkjet printing or screen printing techniques to create circuits on flexible substrates, making it ideal for manufacturing low-cost, lightweight, and flexible circuits. This technology is commonly used in consumer electronics, automotive, and wearable devices, where flexibility and form factor are key requirements. As printing technologies continue to advance and costs decrease, printed electronics are becoming more accessible for mass production, ensuring its dominance in the flexible PCB market.

Asia Pacific Region is Largest Due to High Demand from Electronics and Automotive Sectors

The Asia Pacific region is the largest and most significant market for flexible printed circuit boards, owing to the concentration of leading consumer electronics and automotive manufacturing hubs in countries like China, Japan, and South Korea. The region accounts for the highest demand for flexible PCBs, driven by robust growth in consumer electronics, automotive, and industrial automation sectors. China, as a global manufacturing powerhouse, leads the production of flexible printed circuits, while Japan and South Korea have well-established automotive and electronics industries that require advanced PCB solutions. With the region's significant investment in technology and manufacturing infrastructure, Asia Pacific is expected to remain the largest market for flexible printed circuits in the coming years.

Leading Companies and Competitive Landscape

The flexible printed circuit boards market is highly competitive, with several leading players dominating the global landscape. Companies like Flex Ltd., Sumitomo Electric Industries Ltd., Molex, LLC, and TTM Technologies, Inc. are at the forefront of the industry, offering innovative and high-performance FPCBs for a wide range of applications. These companies continue to innovate in areas such as hybrid circuits, stretchable electronics, and advanced manufacturing processes to meet the growing demand for flexible and durable electronic solutions. The competitive landscape is characterized by ongoing research and development efforts, strategic partnerships, and acquisitions aimed at expanding product portfolios and geographic presence. As demand for flexible circuits grows across various sectors, these companies are well-positioned to capitalize on new market opportunities and maintain their leadership in the industry.

Recent Developments:

  • Flex Ltd. Partners with NXP Semiconductors – In a bid to enhance its IoT product offerings, Flex Ltd. partnered with NXP Semiconductors to integrate advanced flexible circuit technologies into their smart manufacturing solutions.
  • TTM Technologies Acquires Advanced Circuits – TTM Technologies announced the acquisition of Advanced Circuits, expanding its flexible printed circuit board capabilities and strengthening its position in the automotive and industrial electronics markets.
  • Meiko Electronics Launches Flexible Circuit Solutions for Wearables – Meiko Electronics unveiled new flexible circuit board designs tailored for the growing wearables market, optimizing performance in compact devices.
  • Daeduck Electronics Expands Production Capacity – To meet rising demand in automotive and consumer electronics, Daeduck Electronics increased its production capacity for flexible printed circuit boards in Asia.
  • Nippon Mektron Receives Certification for Flexible Circuit Innovation – Nippon Mektron achieved an international certification for its innovative flexible printed circuit boards used in automotive safety systems and medical devices

List of Leading Companies:

  • Flex Ltd.
  • Sumitomo Electric Industries Ltd.
  • Molex, LLC
  • FPC Technology Co. Ltd.
  • TTM Technologies, Inc.
  • Avery Dennison Corporation
  • Nippon Mektron Ltd.
  • LG Innotek Co. Ltd.
  • SAMSUNG Electro-Mechanics
  • Daeduck Electronics Co., Ltd.
  • Zhen Ding Technology Holding Limited
  • Interflex Co. Ltd.
  • Leoni AG
  • Yuen Cheng Technology Ltd.
  • Meiko Electronics Co.

Report Scope:

Report Features

Description

Market Size (2023)

USD 25.9 Billion

Forecasted Value (2030)

USD 42.5 Billion

CAGR (2024 – 2030)

7.3%

Base Year for Estimation

2023

Historic Year

2022

Forecast Period

2024 – 2030

Report Coverage

Market Forecast, Market Dynamics, Competitive Landscape, Recent Developments

Segments Covered

Flexible Printed Circuit Boards Market By Product Type (Single-Sided Flexible Printed Circuits, Double-Sided Flexible Printed Circuits, Multilayer Flexible Printed Circuits, Rigid-Flex Circuits), By End-User Industry (Consumer Electronics, Automotive, Healthcare, Aerospace & Defense, Industrial & Manufacturing, Telecommunications, Energy & Power), By Application (Wearable Devices, Medical Devices, Smartphones, Automotive Electronics, Industrial Automation, LED Lighting, Sensors), By Technology (Printed Electronics, Hybrid Circuits, Thin-Film Flexible Circuits, Stretchable Circuits)

Regional Analysis

North America (US, Canada, Mexico), Europe (Germany, France, UK, Italy, Spain, and Rest of Europe), Asia-Pacific (China, Japan, South Korea, Australia, India, and Rest of Asia-Pacific), Latin America (Brazil, Argentina, and Rest of Latin America), Middle East & Africa (Saudi Arabia, UAE, Rest of Middle East & Africa)

Major Companies

Flex Ltd., Sumitomo Electric Industries Ltd., Molex, LLC, FPC Technology Co. Ltd., TTM Technologies, Inc., Avery Dennison Corporation, Nippon Mektron Ltd., LG Innotek Co. Ltd., SAMSUNG Electro-Mechanics, Daeduck Electronics Co., Ltd., Zhen Ding Technology Holding Limited, Interflex Co. Ltd., Leoni AG, Yuen Cheng Technology Ltd., Meiko Electronics Co.

Customization Scope

Customization for segments, region/country-level will be provided. Moreover, additional customization can be done based on the requirements

1. Introduction

   1.1. Market Definition

   1.2. Scope of the Study

   1.3. Research Assumptions

   1.4. Study Limitations

2. Research Methodology

   2.1. Research Approach

      2.1.1. Top-Down Method

      2.1.2. Bottom-Up Method

      2.1.3. Factor Impact Analysis

  2.2. Insights & Data Collection Process

      2.2.1. Secondary Research

      2.2.2. Primary Research

   2.3. Data Mining Process

      2.3.1. Data Analysis

      2.3.2. Data Validation and Revalidation

      2.3.3. Data Triangulation

3. Executive Summary

   3.1. Major Markets & Segments

   3.2. Highest Growing Regions and Respective Countries

   3.3. Impact of Growth Drivers & Inhibitors

   3.4. Regulatory Overview by Country

4. Flexible Printed Circuit Boards Market, by Product Type (Market Size & Forecast: USD Million, 2022 – 2030)

   4.1. Single-Sided Flexible Printed Circuits

   4.2. Double-Sided Flexible Printed Circuits

   4.3. Multilayer Flexible Printed Circuits

   4.4. Rigid-Flex Circuits

   4.5. Others

5. Flexible Printed Circuit Boards Market, by End-User Industry (Market Size & Forecast: USD Million, 2022 – 2030)

   5.1. Consumer Electronics

   5.2. Automotive

   5.3. Healthcare

   5.4. Aerospace & Defense

   5.5. Industrial & Manufacturing

   5.6. Telecommunications

   5.7. Energy & Power

   5.8. Others

6. Flexible Printed Circuit Boards Market, by Application (Market Size & Forecast: USD Million, 2022 – 2030)

   6.1. Wearable Devices

   6.2. Medical Devices

   6.3. Smart Phones

   6.4. Automotive Electronics

   6.5. Industrial Automation

   6.6. LED Lighting

   6.7. Sensors

   6.8. Others

7. Flexible Printed Circuit Boards Market, by Technology (Market Size & Forecast: USD Million, 2022 – 2030)

   7.1. Printed Electronics

   7.2. Hybrid Circuits

   7.3. Thin-Film Flexible Circuits

   7.4. Stretchable Circuits

   7.5. Others

8. Regional Analysis (Market Size & Forecast: USD Million, 2022 – 2030)

   8.1. Regional Overview

   8.2. North America

      8.2.1. Regional Trends & Growth Drivers

      8.2.2. Barriers & Challenges

      8.2.3. Opportunities

      8.2.4. Factor Impact Analysis

      8.2.5. Technology Trends

      8.2.6. North America Flexible Printed Circuit Boards Market, by Product Type

      8.2.7. North America Flexible Printed Circuit Boards Market, by End-User Industry

      8.2.8. North America Flexible Printed Circuit Boards Market, by Application

      8.2.9. North America Flexible Printed Circuit Boards Market, by Technology

      8.2.10. By Country

         8.2.10.1. US

               8.2.10.1.1. US Flexible Printed Circuit Boards Market, by Product Type

               8.2.10.1.2. US Flexible Printed Circuit Boards Market, by End-User Industry

               8.2.10.1.3. US Flexible Printed Circuit Boards Market, by Application

               8.2.10.1.4. US Flexible Printed Circuit Boards Market, by Technology

         8.2.10.2. Canada

         8.2.10.3. Mexico

    *Similar segmentation will be provided for each region and country

   8.3. Europe

   8.4. Asia-Pacific

   8.5. Latin America

   8.6. Middle East & Africa

9. Competitive Landscape

   9.1. Overview of the Key Players

   9.2. Competitive Ecosystem

      9.2.1. Level of Fragmentation

      9.2.2. Market Consolidation

      9.2.3. Product Innovation

   9.3. Company Share Analysis

   9.4. Company Benchmarking Matrix

      9.4.1. Strategic Overview

      9.4.2. Product Innovations

   9.5. Start-up Ecosystem

   9.6. Strategic Competitive Insights/ Customer Imperatives

   9.7. ESG Matrix/ Sustainability Matrix

   9.8. Manufacturing Network

      9.8.1. Locations

      9.8.2. Supply Chain and Logistics

      9.8.3. Product Flexibility/Customization

      9.8.4. Digital Transformation and Connectivity

      9.8.5. Environmental and Regulatory Compliance

   9.9. Technology Readiness Level Matrix

   9.10. Technology Maturity Curve

   9.11. Buying Criteria

10. Company Profiles

   10.1. Flex Ltd.

      10.1.1. Company Overview

      10.1.2. Company Financials

      10.1.3. Product/Service Portfolio

      10.1.4. Recent Developments

      10.1.5. IMR Analysis

    *Similar information will be provided for other companies 

   10.2. Sumitomo Electric Industries Ltd.

   10.3. Molex, LLC

   10.4. FPC Technology Co. Ltd.

   10.5. TTM Technologies, Inc.

   10.6. Avery Dennison Corporation

   10.7. Nippon Mektron Ltd.

   10.8. LG Innotek Co. Ltd.

   10.9. SAMSUNG Electro-Mechanics

   10.10. Daeduck Electronics Co., Ltd.

   10.11. Zhen Ding Technology Holding Limited

   10.12. Interflex Co. Ltd.

   10.13. Leoni AG

   10.14. Yuen Cheng Technology Ltd.

   10.15. Meiko Electronics Co.

11. Appendix

A comprehensive market research approach was employed to gather and analyze data on the Flexible Printed Circuit Boards Market. In the process, the analysis was also done to analyze the parent market and relevant adjacencies to measure the impact of them on the Flexible Printed Circuit Boards Market. The research methodoloagy encompassed both secondary and primary research techniques, ensuring the accuracy and credibility of the findings.

Research Approach -

Secondary Research

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Secondary research involved a thorough review of pertinent industry reports, journals, articles, and publications. Additionally, annual reports, press releases, and investor presentations of industry players were scrutinized to gain insights into their market positioning and strategies.

Primary Research

Primary research involved conducting in-depth interviews with industry experts, stakeholders, and market participants across the E-Waste Management ecosystem. The primary research objectives included:

  • Validating findings and assumptions derived from secondary research
  • Gathering qualitative and quantitative data on market trends, drivers, and challenges
  • Understanding the demand-side dynamics, encompassing end-users, component manufacturers, facility providers, and service providers
  • Assessing the supply-side landscape, including technological advancements and recent developments

Market Size Assessment

A combination of top-down and bottom-up approaches was utilized to analyze the overall size of the Flexible Printed Circuit Boards Market. These methods were also employed to assess the size of various subsegments within the market. The market size assessment methodology encompassed the following steps:

  1. Identification of key industry players and relevant revenues through extensive secondary research
  2. Determination of the industry's supply chain and market size, in terms of value, through primary and secondary research processes
  3. Calculation of percentage shares, splits, and breakdowns using secondary sources and verification through primary sources

Bottom Up and Top Down -

Data Triangulation

To ensure the accuracy and reliability of the market size, data triangulation was implemented. This involved cross-referencing data from various sources, including demand and supply side factors, market trends, and expert opinions. Additionally, top-down and bottom-up approaches were employed to validate the market size assessment.

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