As per Intent Market Research, the Electronic Adhesives Market was valued at USD 05.5 billion in 2024-e and will surpass USD 08.6 billion by 2030; growing at a CAGR of 7.9% during 2024 - 2030.
The electronic adhesives market is experiencing significant growth due to the increasing demand for high-performance adhesives in various electronic applications. Electronic adhesives are essential in ensuring the reliability and performance of electronic devices by providing strong bonding, insulation, and protection in components like semiconductors, displays, and LED assemblies. As the electronics industry continues to advance with innovations in semiconductors, consumer electronics, and automotive systems, the need for specialized adhesives that can meet the complex requirements of modern devices is more critical than ever. The market is also benefiting from the rise in electric vehicles (EVs), wearable technology, and the demand for efficient and compact consumer electronics.
Epoxy-based Adhesives Dominate the Market Due to Strong Bonding and Versatility
Epoxy-based adhesives are the largest product segment in the electronic adhesives market, owing to their exceptional bonding strength, thermal stability, and versatility. These adhesives are widely used in applications such as semiconductor packaging, display assembly, and LED assembly, where strong, durable bonds are necessary. Epoxy-based adhesives offer excellent resistance to heat, moisture, and chemicals, making them ideal for high-performance electronic devices that require long-lasting reliability.
The widespread use of epoxy-based adhesives is primarily driven by their ability to provide superior adhesion to a wide variety of materials, including metals, ceramics, and plastics. In addition, their ability to withstand high temperatures and harsh environments makes them indispensable in critical electronic applications. The continuous demand for miniaturized and more efficient electronic components further supports the dominance of epoxy-based adhesives in the market.
Conductive Adhesives Show the Fastest Growth Due to Demand in Electronics Miniaturization
Conductive adhesives are one of the fastest-growing product segments in the electronic adhesives market, driven by the increasing trend toward miniaturization and the need for advanced packaging solutions in electronics. These adhesives are used to connect electronic components, such as in integrated circuits (ICs), and provide both bonding and electrical conductivity, which is essential in high-performance electronics like smartphones, wearables, and advanced automotive electronics.
As the demand for more compact and efficient electronic devices increases, conductive adhesives have become essential in enabling smaller, lighter, and more powerful devices. Their unique ability to combine electrical conductivity with adhesive properties makes them crucial in applications such as IC packaging, display assemblies, and automotive electronics. The growth of the Internet of Things (IoT), 5G technology, and electric vehicles is further driving the demand for conductive adhesives, contributing to their rapid market expansion.
Semiconductor & IC Packaging Leads the Market Due to Growing Electronics Industry
The semiconductor and IC packaging application is the largest segment in the electronic adhesives market, as it plays a critical role in the electronics industry. Semiconductors are the backbone of most electronic devices, and their proper packaging is essential to ensure performance, durability, and reliability. Adhesives used in semiconductor packaging must meet strict requirements for thermal conductivity, insulation, and mechanical strength to withstand the stresses encountered during manufacturing and operation.
The increasing demand for semiconductors in consumer electronics, automotive electronics, telecommunications, and industrial manufacturing drives the growth of this application segment. The need for smaller, faster, and more efficient semiconductor devices continues to push the demand for high-performance adhesives, ensuring that the semiconductor and IC packaging segment remains the largest in the electronic adhesives market.
Automotive Electronics Sector Drives Demand for Specialized Adhesives
The automotive electronics sector is one of the fastest-growing end-use industries for electronic adhesives, primarily due to the rapid adoption of advanced electronic systems in vehicles. As automotive manufacturers incorporate more electronic components for functions like navigation, safety, entertainment, and battery management in electric vehicles, the demand for reliable, high-performance adhesives is increasing. These adhesives are used in a wide range of automotive applications, including LED lighting, battery packs, sensors, and powertrains.
The growth of electric vehicles (EVs) and the increasing reliance on automotive electronics for enhanced safety and efficiency are key drivers of this market segment. Adhesives used in automotive electronics must withstand high temperatures, vibrations, and other environmental factors, making the automotive electronics sector a significant area of demand for specialized electronic adhesives.
Electronics & Semiconductor Sector Is the Largest End-Use Industry Driven by Continuous Innovation
The electronics and semiconductor industry is the largest end-use industry for electronic adhesives, accounting for a substantial share of the market. This sector includes consumer electronics, semiconductor devices, telecommunication systems, and industrial electronics, all of which require high-quality adhesives for bonding, encapsulation, and protection. The rapid pace of technological advancements, such as the development of 5G networks, wearable devices, and smart electronics, continues to fuel the demand for adhesives that can meet the growing performance and reliability requirements.
As the electronics industry continues to innovate and develop new devices that are smaller, lighter, and more powerful, the demand for specialized adhesives that offer high bonding strength, electrical conductivity, and thermal resistance will remain strong. The electronics & semiconductor sector's focus on miniaturization and enhanced functionality ensures that it will remain the largest end-user of electronic adhesives.
Asia Pacific Holds the Largest Market Share Due to Robust Electronics Manufacturing and Demand
Asia Pacific is the largest region in the electronic adhesives market, driven by its dominant position in electronics manufacturing and consumption. Countries like China, Japan, South Korea, and Taiwan are global leaders in the production of semiconductors, consumer electronics, and automotive electronics, making the region a key hub for the demand and supply of electronic adhesives. The rapid pace of technological innovation and the continued growth of the electronics industry in Asia Pacific ensure that the region holds the largest market share.
In addition, Asia Pacific is home to several major adhesive manufacturers, who benefit from the region's strong supply chain and low manufacturing costs. The growing adoption of electric vehicles, 5G technology, and advanced consumer electronics further supports the dominance of Asia Pacific in the electronic adhesives market.
Leading Companies and Competitive Landscape
The electronic adhesives market is highly competitive, with several leading companies such as Henkel, 3M, Dow Inc., and Loctite playing a critical role in driving innovation and meeting the demand for high-performance adhesives. These companies focus on research and development to create advanced adhesive solutions that cater to the evolving needs of the electronics industry, including solutions for miniaturization, enhanced conductivity, and environmental sustainability.
Strategic collaborations, acquisitions, and partnerships with key players in the electronics and automotive industries are common strategies to strengthen market position. As the demand for more sophisticated electronic devices increases, these companies are expected to continue expanding their product offerings and improving adhesive performance to maintain their leadership in the electronic adhesives market.
Recent Developments:
List of Leading Companies:
Report Scope:
Report Features |
Description |
Market Size (2024-e) |
USD 5.5 billion |
Forecasted Value (2030) |
USD 8.6 billion |
CAGR (2025 – 2030) |
7.9% |
Base Year for Estimation |
2024-e |
Historic Year |
2023 |
Forecast Period |
2025 – 2030 |
Report Coverage |
Market Forecast, Market Dynamics, Competitive Landscape, Recent Developments |
Segments Covered |
Electronic Adhesives Market By Product Type (Epoxy-based Adhesives, Acrylic-based Adhesives, Silicone-based Adhesives, Polyurethane-based Adhesives, Conductive Adhesives), By Application (Semiconductor & IC Packaging, Display Assembly, LED Assembly, Automotive Electronics, Consumer Electronics), By End-Use Industry (Electronics & Semiconductor, Automotive, Healthcare, Telecommunications, Industrial Manufacturing) |
Regional Analysis |
North America (US, Canada, Mexico), Europe (Germany, France, UK, Italy, Spain, and Rest of Europe), Asia-Pacific (China, Japan, South Korea, Australia, India, and Rest of Asia-Pacific), Latin America (Brazil, Argentina, and Rest of Latin America), Middle East & Africa (Saudi Arabia, UAE, Rest of Middle East & Africa) |
Major Companies |
Henkel AG & Co. KGaA, 3M Company, Dow Inc., H.B. Fuller Company, LG Chem Ltd., Kyocera Corporation, BASF SE, Wacker Chemie AG, Panasonic Corporation, Huntsman Corporation, Dexerials Corporation, DIC Corporation, Lord Corporation, Shin-Etsu Chemical Co., Ltd., Mitsubishi Chemical Corporation |
Customization Scope |
Customization for segments, region/country-level will be provided. Moreover, additional customization can be done based on the requirements |
1. Introduction |
1.1. Market Definition |
1.2. Scope of the Study |
1.3. Research Assumptions |
1.4. Study Limitations |
2. Research Methodology |
2.1. Research Approach |
2.1.1. Top-Down Method |
2.1.2. Bottom-Up Method |
2.1.3. Factor Impact Analysis |
2.2. Insights & Data Collection Process |
2.2.1. Secondary Research |
2.2.2. Primary Research |
2.3. Data Mining Process |
2.3.1. Data Analysis |
2.3.2. Data Validation and Revalidation |
2.3.3. Data Triangulation |
3. Executive Summary |
3.1. Major Markets & Segments |
3.2. Highest Growing Regions and Respective Countries |
3.3. Impact of Growth Drivers & Inhibitors |
3.4. Regulatory Overview by Country |
4. Electronic Adhesives Market, by Product Type (Market Size & Forecast: USD Million, 2022 – 2030) |
4.1. Epoxy-based Adhesives |
4.2. Acrylic-based Adhesives |
4.3. Silicone-based Adhesives |
4.4. Polyurethane-based Adhesives |
4.5. Conductive Adhesives |
4.6. Others |
5. Electronic Adhesives Market, by Application (Market Size & Forecast: USD Million, 2022 – 2030) |
5.1. Semiconductor & IC Packaging |
5.2. Display Assembly |
5.3. LED Assembly |
5.4. Automotive Electronics |
5.5. Consumer Electronics |
5.6. Others |
6. Electronic Adhesives Market, by End-Use Industry (Market Size & Forecast: USD Million, 2022 – 2030) |
6.1. Electronics & Semiconductor |
6.2. Automotive |
6.3. Healthcare |
6.4. Telecommunications |
6.5. Industrial Manufacturing |
6.6. Others |
7. Regional Analysis (Market Size & Forecast: USD Million, 2022 – 2030) |
7.1. Regional Overview |
7.2. North America |
7.2.1. Regional Trends & Growth Drivers |
7.2.2. Barriers & Challenges |
7.2.3. Opportunities |
7.2.4. Factor Impact Analysis |
7.2.5. Technology Trends |
7.2.6. North America Electronic Adhesives Market, by Product Type |
7.2.7. North America Electronic Adhesives Market, by Application |
7.2.8. North America Electronic Adhesives Market, by End-Use Industry |
7.2.9. By Country |
7.2.9.1. US |
7.2.9.1.1. US Electronic Adhesives Market, by Product Type |
7.2.9.1.2. US Electronic Adhesives Market, by Application |
7.2.9.1.3. US Electronic Adhesives Market, by End-Use Industry |
7.2.9.2. Canada |
7.2.9.3. Mexico |
*Similar segmentation will be provided for each region and country |
7.3. Europe |
7.4. Asia-Pacific |
7.5. Latin America |
7.6. Middle East & Africa |
8. Competitive Landscape |
8.1. Overview of the Key Players |
8.2. Competitive Ecosystem |
8.2.1. Level of Fragmentation |
8.2.2. Market Consolidation |
8.2.3. Product Innovation |
8.3. Company Share Analysis |
8.4. Company Benchmarking Matrix |
8.4.1. Strategic Overview |
8.4.2. Product Innovations |
8.5. Start-up Ecosystem |
8.6. Strategic Competitive Insights/ Customer Imperatives |
8.7. ESG Matrix/ Sustainability Matrix |
8.8. Manufacturing Network |
8.8.1. Locations |
8.8.2. Supply Chain and Logistics |
8.8.3. Product Flexibility/Customization |
8.8.4. Digital Transformation and Connectivity |
8.8.5. Environmental and Regulatory Compliance |
8.9. Technology Readiness Level Matrix |
8.10. Technology Maturity Curve |
8.11. Buying Criteria |
9. Company Profiles |
9.1. Henkel AG & Co. KGaA |
9.1.1. Company Overview |
9.1.2. Company Financials |
9.1.3. Product/Service Portfolio |
9.1.4. Recent Developments |
9.1.5. IMR Analysis |
*Similar information will be provided for other companies |
9.2. 3M Company |
9.3. Dow Inc. |
9.4. H.B. Fuller Company |
9.5. LG Chem Ltd. |
9.6. Kyocera Corporation |
9.7. BASF SE |
9.8. Wacker Chemie AG |
9.9. Panasonic Corporation |
9.10. Huntsman Corporation |
9.11. Dexerials Corporation |
9.12. DIC Corporation |
9.13. Lord Corporation |
9.14. Shin-Etsu Chemical Co., Ltd. |
9.15. Mitsubishi Chemical Corporation |
10. Appendix |
A comprehensive market research approach was employed to gather and analyze data on the Electronic Adhesives Market. In the process, the analysis was also done to analyze the parent market and relevant adjacencies to measure the impact of them on the Electronic Adhesives Market. The research methodology encompassed both secondary and primary research techniques, ensuring the accuracy and credibility of the findings.
Secondary research involved a thorough review of pertinent industry reports, journals, articles, and publications. Additionally, annual reports, press releases, and investor presentations of industry players were scrutinized to gain insights into their market positioning and strategies.
Primary research involved conducting in-depth interviews with industry experts, stakeholders, and market participants across the E-Waste Management ecosystem. The primary research objectives included:
A combination of top-down and bottom-up approaches was utilized to analyze the overall size of the Electronic Adhesives Market. These methods were also employed to assess the size of various subsegments within the market. The market size assessment methodology encompassed the following steps:
To ensure the accuracy and reliability of the market size, data triangulation was implemented. This involved cross-referencing data from various sources, including demand and supply side factors, market trends, and expert opinions. Additionally, top-down and bottom-up approaches were employed to validate the market size assessment.