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Application Specific Integrated Circuit (ASIC) Market By Design Type (Full-Custom ASIC, Semi-Custom ASIC, Programmable ASIC), By Technology (7nm Process Technology, 10nm Process Technology, 16nm Process Technology, 28nm Process Technology), By End-Use Industry (Consumer Electronics, Automotive, Industrial Automation, Telecommunications, Healthcare, Aerospace and Defense), By Application (Communication, Networking, Automotive Electronics, Consumer Electronics, Industrial Automation, Healthcare), and By Region; Global Insights & Forecast (2024 – 2030)

Published: December, 2024  
|   Report ID: SE4740  
|   Semiconductor and Electronics

As per Intent Market Research, the Application Specific Integrated Circuit Market was valued at USD 15.5 billion in 2023 and will surpass USD 32.6 billion by 2030; growing at a CAGR of 11.2% during 2024 - 2030.

The Application Specific Integrated Circuit (ASIC) market is poised for substantial growth as technological advancements continue to demand more specialized, efficient, and powerful chips. ASICs are custom-designed integrated circuits tailored for specific applications, offering advantages over general-purpose chips in terms of performance, power efficiency, and space optimization. These circuits find extensive use across various industries, including consumer electronics, automotive, telecommunications, industrial automation, and healthcare, with applications in everything from mobile devices to autonomous vehicles. As industries continue to innovate, the demand for customized solutions drives the evolution of the ASIC market.

Full-Custom ASIC Segment Is Largest Owing to Specialized Functionality

Among the various design types, Full-Custom ASICs hold the largest market share. These chips are designed from the ground up to perform specific tasks, making them ideal for applications requiring high performance, minimal power consumption, and compact size. The ability to tailor every aspect of the chip, including the layout and logic, provides significant advantages for industries that rely on speed and reliability. Full-custom ASICs are widely used in industries like consumer electronics, automotive, and telecommunications, where performance is critical, and general-purpose processors cannot meet the specific needs of the application.

Full-custom ASICs are particularly in demand within the consumer electronics sector, where companies like Apple and Samsung design custom chips to power smartphones, tablets, and wearables. These chips are designed to handle intensive tasks such as image processing, wireless communication, and machine learning efficiently. Full-custom ASICs are also indispensable in sectors like automotive, particularly in the development of autonomous vehicles, where custom chips are required to handle real-time processing of sensor data, navigation systems, and decision-making algorithms.

Application Specific Integrated Circuit Market Size

7nm Process Technology Is Fastest Growing Owing to Efficiency Gains

In terms of technology, 7nm process technology is the fastest growing in the ASIC market. This advanced process node allows for the creation of smaller, more power-efficient chips with higher performance capabilities. The 7nm technology is particularly beneficial for industries that demand high-speed processing, such as consumer electronics, telecommunications, and automotive. As the demand for faster processing and low-power devices increases, companies are increasingly adopting 7nm technology to meet these requirements.

The growth of 7nm technology is driven by its widespread adoption in smartphones, high-performance computing, and data centers. Major semiconductor companies, including TSMC and Samsung, are ramping up production at their 7nm nodes, enabling the development of chips with greater power efficiency and reduced heat generation. These benefits make 7nm ASICs ideal for applications in areas such as 5G communication and next-generation automotive systems, where efficiency and performance are paramount.

Automotive Industry Is Largest Due to Increasing Demand for Advanced Electronics

The automotive end-use industry holds a significant portion of the ASIC market. As vehicles become more connected and autonomous, the demand for specialized chips that can handle complex tasks has surged. Automotive manufacturers are increasingly incorporating ASICs into autonomous driving systems, infotainment systems, and electric vehicle battery management systems, among other applications. These chips are crucial for real-time data processing and communication, allowing vehicles to make quick decisions based on sensor inputs and environmental data.

The automotive industry is particularly benefiting from the adoption of ASICs in autonomous driving technologies, where the processing power of custom chips is essential for tasks such as obstacle detection, path planning, and machine learning algorithms. Additionally, electric vehicles (EVs) require ASICs for battery management and power conversion systems, making the automotive sector a key driver of ASIC market growth. With increasing investments in electric and autonomous vehicles, the automotive segment is expected to remain a major consumer of ASICs in the coming years.

Networking Application Is Largest Due to Growing Data Demand

The networking application segment is the largest in the ASIC market, driven by the increasing need for high-speed data transmission in both consumer and enterprise environments. Networking equipment, such as routers, switches, and firewalls, requires specialized ASICs for tasks like packet switching, encryption, and data routing. The rise in data traffic, fueled by trends such as 5G, cloud computing, and the Internet of Things (IoT), has significantly increased the demand for networking ASICs that can handle large volumes of data efficiently and with minimal latency.

The 5G rollout is one of the key factors propelling the demand for networking ASICs. These chips are crucial for the development of 5G infrastructure, which requires high-performance processing capabilities to handle the increased speed and bandwidth demands. As enterprises and service providers invest heavily in upgrading their networks to support 5G, the need for specialized ASICs will continue to grow, cementing networking as a dominant application segment.

Asia-Pacific Region Is Fastest Growing Due to Increased Demand for Consumer Electronics and Automotive

The Asia-Pacific region is the fastest growing in the ASIC market, driven by the booming demand for consumer electronics, automotive technologies, and industrial automation in countries like China, Japan, South Korea, and India. The region is home to some of the world's largest manufacturers of consumer electronics, automotive components, and telecommunications infrastructure, all of which rely heavily on ASICs for performance optimization. Additionally, the growing adoption of electric vehicles and autonomous driving technologies in Asia-Pacific countries is further fueling demand for specialized chips.

China, in particular, has emerged as a key player in the global ASIC market, with significant investments in local semiconductor production and the development of cutting-edge technologies like 5G and AI. The region’s robust manufacturing capabilities and the expanding presence of global tech giants have positioned Asia-Pacific as a major hub for the development and production of ASICs, particularly in sectors such as consumer electronics and automotive.

Application Specific Integrated Circuit Market Size by Region 2030

Competitive Landscape and Leading Companies

The ASIC market is highly competitive, with a mix of established semiconductor giants and specialized chipmakers leading the way. Key players such as Intel, TSMC, Samsung, Qualcomm, and Broadcom dominate the market, leveraging their advanced fabrication technologies and design expertise to produce cutting-edge custom chips. These companies have deep investments in process technologies like 7nm and 10nm nodes, enabling them to stay ahead in the rapidly evolving ASIC space.

As the demand for ASICs continues to grow, companies are focusing on expanding their product portfolios to cater to specific industries, particularly automotive and telecommunications. Collaboration with industry leaders in automotive and networking, along with strategic acquisitions, has become a key growth strategy. For instance, NXP Semiconductors has strengthened its position in the automotive market, while AMD’s acquisition of Xilinx has expanded its capabilities in programmable and semi-custom ASICs. As demand for customized chips rises, competition among these leading companies is expected to intensify, pushing for even more innovative and efficient ASIC solutions.

Recent Developments:

  • Intel has announced the development and production of its next-generation 7nm process technology for ASICs, promising improved power efficiency and performance for high-demand applications in automotive and telecommunications.
  • Taiwan Semiconductor Manufacturing Company (TSMC) is ramping up production at its 5nm and 7nm nodes to meet the growing demand for custom ASICs used in advanced consumer electronics and automotive systems.  
  • Qualcomm has completed its acquisition of Nuvia, enhancing its ASIC capabilities with custom-designed chips for mobile and computing applications, strengthening its market position in mobile processors.    
  • Samsung Electronics has launched a new line of ASICs designed specifically for Internet of Things (IoT) devices, focusing on low-power consumption and high-performance capabilities for smart homes and industrial IoT.      
  • AMD's acquisition of Xilinx has bolstered its position in the ASIC market, enabling AMD to offer comprehensive solutions for industries such as aerospace, defense, and industrial automation, enhancing its portfolio of high-performance custom chips.  

List of Leading Companies:

  • Intel Corporation
  • Qualcomm Incorporated
  • Broadcom Inc.
  • Taiwan Semiconductor Manufacturing Company (TSMC)
  • Samsung Electronics
  • Micron Technology
  • NXP Semiconductors
  • Advanced Micro Devices (AMD)
  • Texas Instruments
  • Infineon Technologies
  • MediaTek
  • Apple Inc.
  • Xilinx (Acquired by AMD)
  • STMicroelectronics
  • ON Semiconductor

Report Scope:

Report Features

Description

Market Size (2023)

USD 15.5 Billion

Forecasted Value (2030)

USD 32.6 Billion

CAGR (2024 – 2030)

11.2%

Base Year for Estimation

2023

Historic Year

2022

Forecast Period

2024 – 2030

Report Coverage

Market Forecast, Market Dynamics, Competitive Landscape, Recent Developments

Segments Covered

Application Specific Integrated Circuit (ASIC) Market By Design Type (Full-Custom ASIC, Semi-Custom ASIC, Programmable ASIC), By Technology (7nm Process Technology, 10nm Process Technology, 16nm Process Technology, 28nm Process Technology), By End-Use Industry (Consumer Electronics, Automotive, Industrial Automation, Telecommunications, Healthcare, Aerospace and Defense), By Application (Communication, Networking, Automotive Electronics, Consumer Electronics, Industrial Automation, Healthcare)

Regional Analysis

North America (US, Canada, Mexico), Europe (Germany, France, UK, Italy, Spain, and Rest of Europe), Asia-Pacific (China, Japan, South Korea, Australia, India, and Rest of Asia-Pacific), Latin America (Brazil, Argentina, and Rest of Latin America), Middle East & Africa (Saudi Arabia, UAE, Rest of Middle East & Africa)

Major Companies

Intel Corporation, Qualcomm Incorporated, Broadcom Inc., Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics, Micron Technology, NXP Semiconductors, Advanced Micro Devices (AMD), Texas Instruments, Infineon Technologies, MediaTek, Apple Inc., Xilinx (Acquired by AMD), STMicroelectronics, ON Semiconductor

Customization Scope

Customization for segments, region/country-level will be provided. Moreover, additional customization can be done based on the requirements

1. Introduction

   1.1. Market Definition

   1.2. Scope of the Study

   1.3. Research Assumptions

   1.4. Study Limitations

2. Research Methodology

   2.1. Research Approach

      2.1.1. Top-Down Method

      2.1.2. Bottom-Up Method

      2.1.3. Factor Impact Analysis

  2.2. Insights & Data Collection Process

      2.2.1. Secondary Research

      2.2.2. Primary Research

   2.3. Data Mining Process

      2.3.1. Data Analysis

      2.3.2. Data Validation and Revalidation

      2.3.3. Data Triangulation

3. Executive Summary

   3.1. Major Markets & Segments

   3.2. Highest Growing Regions and Respective Countries

   3.3. Impact of Growth Drivers & Inhibitors

   3.4. Regulatory Overview by Country

4. Application Specific Integrated Circuit, by Design Type (Market Size & Forecast: USD Million, 2022 – 2030)

   4.1. Full-Custom ASIC

   4.2. Semi-Custom ASIC

   4.3. Programmable ASIC

5. Application Specific Integrated Circuit, by Technology (Market Size & Forecast: USD Million, 2022 – 2030)

   5.1. 7nm Process Technology

   5.2. 10nm Process Technology

   5.3. 16nm Process Technology

   5.4. 28nm Process Technology

   5.5. Others

6. Application Specific Integrated Circuit, by End-Use Industry (Market Size & Forecast: USD Million, 2022 – 2030)

   6.1. Consumer Electronics

   6.2. Automotive

   6.3. Industrial Automation

   6.4. Telecommunications

   6.5. Healthcare

   6.6. Aerospace and Defense

   6.7. Others

7. Application Specific Integrated Circuit, by  Application (Market Size & Forecast: USD Million, 2022 – 2030)

   7.1. Communication

   7.2. Networking

   7.3. Automotive Electronics

   7.4. Consumer Electronics

   7.5. Industrial Automation

   7.6. Healthcare

   7.7. Others

8. Regional Analysis (Market Size & Forecast: USD Million, 2022 – 2030)

   8.1. Regional Overview

   8.2. North America

      8.2.1. Regional Trends & Growth Drivers

      8.2.2. Barriers & Challenges

      8.2.3. Opportunities

      8.2.4. Factor Impact Analysis

      8.2.5. Technology Trends

      8.2.6. North America Application Specific Integrated Circuit, by Design Type

      8.2.7. North America Application Specific Integrated Circuit, by Technology

      8.2.8. North America Application Specific Integrated Circuit, by End-Use Industry

      8.2.9. North America Application Specific Integrated Circuit, by  Application

      8.2.10. By Country

         8.2.10.1. US

               8.2.10.1.1. US Application Specific Integrated Circuit, by Design Type

               8.2.10.1.2. US Application Specific Integrated Circuit, by Technology

               8.2.10.1.3. US Application Specific Integrated Circuit, by End-Use Industry

               8.2.10.1.4. US Application Specific Integrated Circuit, by  Application

         8.2.10.2. Canada

         8.2.10.3. Mexico

    *Similar segmentation will be provided for each region and country

   8.3. Europe

   8.4. Asia-Pacific

   8.5. Latin America

   8.6. Middle East & Africa

9. Competitive Landscape

   9.1. Overview of the Key Players

   9.2. Competitive Ecosystem

      9.2.1. Level of Fragmentation

      9.2.2. Market Consolidation

      9.2.3. Product Innovation

   9.3. Company Share Analysis

   9.4. Company Benchmarking Matrix

      9.4.1. Strategic Overview

      9.4.2. Product Innovations

   9.5. Start-up Ecosystem

   9.6. Strategic Competitive Insights/ Customer Imperatives

   9.7. ESG Matrix/ Sustainability Matrix

   9.8. Manufacturing Network

      9.8.1. Locations

      9.8.2. Supply Chain and Logistics

      9.8.3. Product Flexibility/Customization

      9.8.4. Digital Transformation and Connectivity

      9.8.5. Environmental and Regulatory Compliance

   9.9. Technology Readiness Level Matrix

   9.10. Technology Maturity Curve

   9.11. Buying Criteria

10. Company Profiles

   10.1. Intel Corporation

      10.1.1. Company Overview

      10.1.2. Company Financials

      10.1.3. Product/Service Portfolio

      10.1.4. Recent Developments

      10.1.5. IMR Analysis

    *Similar information will be provided for other companies 

   10.2. Qualcomm Incorporated

   10.3. Broadcom Inc.

   10.4. Taiwan Semiconductor Manufacturing Company (TSMC)

   10.5. Samsung Electronics

   10.6. Micron Technology

   10.7. NXP Semiconductors

   10.8. Advanced Micro Devices (AMD)

   10.9. Texas Instruments

   10.10. Infineon Technologies

   10.11. MediaTek

   10.12. Apple Inc.

   10.13. Xilinx (Acquired by AMD)

   10.14. STMicroelectronics

   10.15. ON Semiconductor

11. Appendix

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A comprehensive market research approach was employed to gather and analyze data on the Application Specific Integrated Circuit Market. In the process, the analysis was also done to analyze the parent market and relevant adjacencies to measure the impact of them on the Application Specific Integrated Circuit Market. The research methodology encompassed both secondary and primary research techniques, ensuring the accuracy and credibility of the findings.

Research Approach - Application Specific Integrated Circuit Market

Secondary Research

Secondary research involved a thorough review of pertinent industry reports, journals, articles, and publications. Additionally, annual reports, press releases, and investor presentations of industry players were scrutinized to gain insights into their market positioning and strategies.

Primary Research

Primary research involved conducting in-depth interviews with industry experts, stakeholders, and market participants across the Application Specific Integrated Circuit ecosystem. The primary research objectives included:

  • Validating findings and assumptions derived from secondary research
  • Gathering qualitative and quantitative data on market trends, drivers, and challenges
  • Understanding the demand-side dynamics, encompassing end-users, component manufacturers, facility providers, and service providers
  • Assessing the supply-side landscape, including technological advancements and recent developments

Market Size Assessment

A combination of top-down and bottom-up approaches was utilized to analyze the overall size of the Application Specific Integrated Circuit Market. These methods were also employed to assess the size of various subsegments within the market. The market size assessment methodology encompassed the following steps:

  1. Identification of key industry players and relevant revenues through extensive secondary research
  2. Determination of the industry's supply chain and market size, in terms of value, through primary and secondary research processes
  3. Calculation of percentage shares, splits, and breakdowns using secondary sources and verification through primary sources

Bottom Up and Top Down - Application Specific Integrated Circuit Market

Data Triangulation

To ensure the accuracy and reliability of the market size, data triangulation was implemented. This involved cross-referencing data from various sources, including demand and supply side factors, market trends, and expert opinions. Additionally, top-down and bottom-up approaches were employed to validate the market size assessment.

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